According to a report by PC Games Hardware, AMD’s next-generation Ryzen 8000 “Granite Ridge” desktop processor, which is based on the “Zen 5” microarchitecture, will continue to have a maximum CPU core-count of 16 cores and 32 threads. The CPU will maintain the two 8-core “Zen 5” CCDs and one I/O die chiplet design of the existing Ryzen 7000 “Raphael” processor. Similar to how it used the same 12 nm cIOD between Ryzen 3000 “Matisse” and Ryzen 5000 “Vermeer,” AMD is extremely likely to reuse the 6 nm client I/O die (cIOD) for “Raphael,” but with upgrades that could enable faster DDR5 memory speeds. One MB of dedicated L2 cache and 32 MB of shared L3 cache are provided for each of the eight CPU cores on each of the two “Eldora” Zen 5 CCDs. The TSMC 3 nm EUV silicon fabrication method is very likely to be used to manufacture the CCDs.

The TDP figures cited in the PCGH leak, which continue to indicate higher-performance SKUs with 170 W TDP and lower tiers with 65 W TDP, are arguably its most intriguing feature. AMD would rely on not only the generational IPC improvement of its “Zen 5” cores, but also on turning up clock speeds to maximize performance within the power envelope of the new node, since its CPU core-counts are not increasing. AMD’s Ryzen 7000 “Zen 4” CPUs on the desktop platform could last beyond 2023, with “Granite Ridge” only expected to go into production in Q1-2024. In the interim, the business might modernize its product stack, possibly bringing the 4 nm “Phoenix” monolithic APU silicon to the Socket AM5 desktop platform. It is anticipated that Ryzen 8000 would remain fully compatible with motherboards using the Socket AM5 and AMD 600-series chipset.