Apparently Intel’s DG2 alludes to various HPG (High Performance Graphics) items inside a similar family, with bits of gossip surfacing around a potential complete of six distinct illustrations items dependent on the organization’s most recent superior designs engineering – and its introduction on the elite discrete market. It’s been affirmed that Intel’s DG2 items won’t be made in-house, by means of Intel’s 10 nm SuperFin innovation, however with plan of action to foundry accomplice TSMC’s 6 nm manufacture innovation.

It appears to be that DG2 is right now scheduled for dispatch dependent on three distinctive chip setups: the first is the DG2 512EU, which resolve the best, 4096 concealing unit, 8 GB/16 GB GDDR6 and 192-piece transport illustrations card. Another chip is the DG12 384EU, assessed to come in at ~190 mm², accessible in three distinctive concealing unit designs: 3072 concealing units, with a going with 6/12 GB of GDDR6 memory and 192-bit transport; 2048 concealing units, which diminishes allocated memory to 4/8 GB setups and a 128-cycle memory transport; lastly, the further cut-down 1536 concealing unit arrangement, with a limit of 4 GB of GDDR6 memory over a similar 128-bit transport. The last (current) chip in the DG2 family is the DG2 128EU, with both 128EU and 96EU setups (1024 and 768 concealing units, individually) conveying 4 GB VRAM over a very close 64-cycle transport. We’ll check whether these breaks really appear into last Intel items, and if these plan decisions are the conceivable best, thinking about Intel’s innovation, in order to attack the two-player party that is the discrete, elite designs market.

Sources: Videocardz, via Twitter