AMD “Genoa” Expected to Cram Up to 96 Cores, MCM Imagined

AMD’s cutting edge EPYC enterprise processor that succeeds the forthcoming third Gen EYPIC “Milan,” codenamed “Genoa,” is required to be the primary significant stage update for AMD’s undertaking stages since the 2017 presentation of the “Zen” based “Naples.” Implementing the most recent I/O interfaces, like DDR5 memory and PCI-Express gen 5.0, the chip will likewise expand CPU center checks by half over “Milan,” as indicated by ExecutableFix on Twitter, a dependable source with bits of gossip from the semiconductor business. To empower the objectives of new I/O and expanded center tallies, AMD will change to another CPU attachment type, the SP5. This is a 6,096-pin land network exhibit (LGA), and the “Genoa” MCM bundle on SP5 is envisioned to be noticeably bigger than SP3-age bundles.

With the additional fiberglass substrate land, AMD is required to add more CPU chiplets to the bundle, and ExecutableFix expects the chiplet check to be expanded to 12. AMD is relied upon to make a big appearance the “Zen 4” microarchitecture in the venture space with “Genoa,” with the CPU chiplets expected to be based on the 5 nm EUV silicon creation hub. Expecting the chiplets still just pack 8 centers a piece, “Genoa” could pack up to 96 centers for every attachment, or up to 192 intelligent processors, with SMT empowered.

The sIOD kick the bucket (I/O complex) is another part with significant changes. AMD is required to expand the memory transport width by half, with the processor currently expected to accompany as 12-channel DDR5 memory interface, locally supporting DDR5-5333. The PCI-Express path financial plan seems unaltered, with up to 128 paths for each attachment, yet actualizes the most recent PCI-Express gen 5.0, which is relied upon to twofold transmission capacity over the current PCIe gen 4.0. In an offer to lessen the pass on size of the sIOD, and all the more critically its TDP, AMD may at last form it on more up to date silicon creation hubs, like 7 nm. ExecutableFix expects the by and large TDP of “Genoa” to be around 320 W, configurable up to 400 W.

AMD is relied upon to make a big appearance “Genoa” exclusively by mid/late 2022, all things considered at this point to adapt the third Gen EPYC “Milan.”

Sources: ExecutableFix (Twitter) 1, ExecutableFix (Twitter) 2, via Videocardz