The FL1 package is retained by AMD Ryzen “Fire Range” mobile processor.
AMD is preparing a follow-up to its “Dragon Range” mobile processor for gaming notebooks and portable workstations, which is part of the Ryzen 7045 family. Although its processor model name is still unknown, the chip is known under the codename “Fire Range.” It will continue to be pin-compatible and maintain the FL1 package as “Dragon Range,” according to what we’ve learned. For notebook OEMs, this would mean a huge reduction in development costs because they could simply use the mainboard designs from existing “Dragon Range” notebooks.
A mobile BGA variant of the impending Ryzen 9000 “Granite Ridge” desktop processor, “Fire Range” is basically that. Similar to the desktop chip, the FL1 package is 40 mm by 40 mm in size and has substrate for two CCDs and a cIOD. Hence, “Fire Range” includes the 6 nm client I/O die and one or two 4 nm “Zen 5” CCDs, depending on the processor model. Like “Dragon Range,” the “Fire Range” chip will only support standard PC DDR5 memory in the SO-DIMM or CAMM2 form-factors and will not support LPDDR5. The primary advantage of “Fire Range” over “Strix Point” will be its 28-lane PCIe Gen 5 root-complex, which can wire out the fastest discrete mobile GPUs and drive multiple M.2 NVMe slots with Gen 5 wiring. It can also drive other high-bandwidth devices, like Thunderbolt 4, USB4, or Wi-Fi 7 controllers wired directly to the processor. This is in addition to the CPU core count consisting only of full-sized “Zen 5” cores.