Longsys Launches DDR5 Memory and Publishes Test Data

Longsys Launches DDR5 Memory and Publishes Test Data

Longsys Electronics dispatches the Longsys DDR5 memory module (ES1). The organization has done as such to stay aware of the improvement of capacity advances, to meet assumptions from industry experts and clients in regards to future item innovation improvement, and to give more prospects to the eventual fate of capacity...

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Samsung Demonstrates 256 Gb 3 nm MBCFET Chip at ISSCC 2021

Samsung Demonstrates 256 Gb 3 nm MBCFET Chip at ISSCC 2021

During the IEEE International Solid-State Circuits Conference (ISSCC), Samsung Foundry has presented a new step towards smaller and more efficient nodes. The new chip that was presented is a 256 Gb memory chip, based on SRAM technology. However, all of that doesn’t sound interesting, until we mention the technology that...

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XPG Memory and Solid State Drives Support Latest Intel Z590 Platform

XPG Memory and Solid State Drives Support Latest Intel Z590 Platform

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, has been working closely with four major motherboard makers (ASUS, MSI, GIGABYTE, and ASRock) to test and optimize the performance of XPG’s latest DDR4 memory modules and PCIe Gen 4×4 solid state drive (SSD)...

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JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard

JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD304-4.01 DDR4 NVDIMM-P Bus Protocol. The JEDEC NVDIMM-P standard will enable the industry to create advanced memory solutions that benefit from the enhanced system performance and novel data availability offered...

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Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power

Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power

Samsung Electronics, the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power—the HBM-PIM. The new processing-in-memory (PIM) architecture brings powerful AI computing capabilities inside high-performance memory, to accelerate large-scale processing in data centers,...

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Samsung to Build $17 Billion Silicon Manufacturing Plant in the US by 2023

Samsung to Build $17 Billion Silicon Manufacturing Plant in the US by 2023

Samsung has been one of the world’s biggest foundries and one of three big players still left in the leading-edge semiconductor process development and manufacturing. However, the Korean giant is always seeking ways to improve its offerings, especially for Western customers. Today, it is reported that Samsung has reportedly talked...

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Team Group Announces XTREEM ARGB White Gaming Memory and Delta MAX White RGB SSD

Team Group Announces XTREEM ARGB White Gaming Memory and Delta MAX White RGB SSD

he XTREEM ARGB GAMING MEMORY, winner of the 2020 German Red Dot Design Award, and the DELTA MAX RGB SSD with its ultra-large, cutting-edge RGB panel continue to receive great attention inside and outside the industry. Today, TEAMGROUP is releasing brand new models in a lustrous, clean white for both...

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NAND Flash Wafer Prices Stabilize Due to High SSD Demand from PC OEMs, Says TrendForce

NAND Flash Wafer Prices Stabilize Due to High SSD Demand from PC OEMs, Says TrendForce

NAND Flash demand continues to rise as strong sales of notebook (laptop) computers spur PC OEMs to place additional orders for client SSDs, according to TrendForce’s latest investigations. Also, the supply-side inventory for NAND Flash memory has already fallen considerably due to the aggressive stock-up activities of some smartphone brands....

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